職種・勤務地・キーワードで探す
条件を変える
東京都のハードウェアエンジニアの求人106件応募資格・募集要項・仕事内容を見る
High-Speed I/F Subsystem Design Leader
- 給与
- 記載なし
- 勤務地
- 東京都小平市
- 休日
- 記載なし
- 雇用形態
- 正社員
- オフィス出社
どんな仕事かAIによる生成
Play a key role in specification definition and architectural study of the High-Speed I/F subsystem for automotive SoCs (R-Car series), including PCIe, UCIe, USB and UFS-related areas. Identify and structure technical issues, contribute to design decisions, and collaborate with design teams in India and Vietnam and with IP vendors.
この求人に応募
応募資格
必須
- Hands-on experience in at least one of PCIe, UCIe, USB, UFS, including specification study, design, verification, or performance evaluation:
- Ability to organize design directions and key discussion points based on requirements and share them with stakeholders.
- Understanding of the logic design and verification flow, and experience actively participating in technical reviews/discussions.
- Communication skills to collaborate across teams and contribute to technical consensus building.
- Willingness and ability to communicate in English for technical meetings and specification reviews.
歓迎
- Experience taking a technical lead role at subsystem or IP level (e.g., leading design reviews, guiding technical discussions).
- Experience in SoC integration involving PCIe, UCIe, USB and UFS-related components.
- Knowledge of power domain separation and physical implementation considerations (e.g., P&R).
- Experience in automotive SoC development or design/verification with functional safety or reliability considerations.
- Experience in technical communication and coordination with overseas sites and/or third‑party IP vendors.
- Japanese language proficiency at a conversational level
募集要項最終確認 10/23
- 職種
- ハードウェアエンジニア
- 雇用形態
- Full-time
- 役職
- High-Speed I/F Subsystem Design Leader
- 給与
- 記載なし
- 勤務地
- Kodaira, Japan
- 働き方
- リモート No
- 掲載日
- 2026/10/20 23:05（3日前）
- 最終確認
- 2026/10/23 02:51（今日）
仕事内容
Background of the Recruitment
- As vehicles become increasingly electrified and intelligent, automotive SoCs are now positioned as a central technology supporting vehicle performance and functionality. The R-Car series has continued to grow as a large‑scale SoC through the advanced integration of numerous and diverse IPs, including CPU, memory, high‑speed interfaces, AI, video, functional safety, and security. Our organization is responsible not only for in‑house IP development but also for the selection, integration, and implementation of external IPs, making the strengthening of technical leadership in core areas such as the High-Speed I/F subsystem a key focus. Against this background, we are seeking technical leaders who can define design direction, make sound technical decisions, and move development forward in collaboration with surrounding teams and IP vendors. This role offers an opportunity for engineers who wish to drive development with a strong technical foundation while preparing to take on broader responsibilities in the future.
Job Description
- Play a key role in specification definition and architectural study of the High-Speed I/F subsystem for automotive SoCs (R-Car series).
- Work on the High-Speed I/F subsystem including PCIe, UCIe, USB and UFS-related areas, and organize design directions from a subsystem-level optimization perspective while owning a primary technical area.
- During logic design and verification phases, identify and structure technical issues, contribute to design decisions, and help drive development forward.
- Consider constraints such as power, performance, and reliability, and make technical judgments consistent with overall SoC requirements.
- For integrated third‑party IPs, communicate with IP vendors to confirm specifications, clarify constraints/assumptions, and support issue resolution.
- Collaborate with design teams in India and Vietnam and with IP vendors, working in English within a global development environment.
- ※The full details regarding your position scope as well as any future potential changes in work location and job scope will be provided during the interview process.
この求人は、ルネサスエレクトロニクス株式会社の採用ページの内容をAIが読み取って整理したものです。応募の前に採用ページの原文を確かめてください。データの集め方企業サイト
同じ会社の求人146件
- Semiconductor Assembly Process Technology Development Engineer
- 半導体組立工程 技術開発エンジニア
- HPC Automotive MCU Test Engineer
- Principal Engineer, Analog / Mixed-Signal IC Design
- パワーデバイス開発エンジニア
- 半導体組立工程 技術開発エンジニア
職種と勤務地が似ている求人東京都のハードウェアエンジニア 106件
- 半導体パッケージ電気設計技術者
- SOC FE Design Engineer（SoCフロントエンド設計エンジニア）
- Principal Engineer, Analog / Mixed-Signal IC Design
- システム開発セクション ハードウェアエンジニア
- ゲーム筐体のハードウェア開発
- HPC DDR Controller Design Engineer / Leader
募集元の採用ページから応募できます
応募はルネサスエレクトロニクス株式会社の採用ページで受け付けています。このページは採用ページの掲載内容をもとに構成しているため、最新の応募条件は募集元でご確認ください。
この求人と近い条件で探す数字はリンク先ページの掲載件数
応募資格の語から探す
この職種で探す
- ハードウェアエンジニア315
- 東京都のハードウェアエンジニア106
- テック14,983
- 組み込み・ファームウェアエンジニア696
- IoTエンジニア45