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Packaging Engineer - HV GaN module
- 給与
- 記載なし
- 勤務地
- 記載なし
- 休日
- 記載なし
- 雇用形態
- 記載なし
どんな仕事かAIによる生成
Develops and characterizes high-voltage packages and high-power modules for AI infrastructure and industrial markets. The role defines packaging solutions across GaN, SiC, IGBT, and isolation technologies, qualifies materials, and collaborates with cross-functional teams to develop and ramp new products.
この求人に応募
応募資格
必須
- MS degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
- 5+ years of hands-on experience in high voltage (200V–1200V) or high-power semiconductor packaging across GaN, SiC, IGBT technologies.
- Hands-on experience with HV package and power module design, materials, and assembly flow integration (molded packages such as TOLT, TOLG, Q-DPAK, DIP, SIP and case modules).
- Familiarity with HV Bill of Materials including mold compounds, die attach, and DBC substrates.
- Experience with stress, thermal, and electrical parasitic modeling tools.
- Understanding of HV discrete and power module reliability and qualification requirements; ability to support qualification activities and contribute to problem solving.
- Good communication skills; able to work effectively with internal teams and external suppliers.
- Proficiency in English and Japanese.
- Prior experience supporting scale-up of HV packages or modules from prototype to volume manufacturing.
- Experience in presenting technical work at internal reviews or industry conferences
- Working knowledge of clip attach, flip chip packaging, and wafer bumping processes.
歓迎
- Prior experience supporting scale-up of HV packages or modules from prototype to volume manufacturing.
- Experience in presenting technical work at internal reviews or industry conferences
- Working knowledge of clip attach, flip chip packaging, and wafer bumping processes.
募集要項最終確認 10/26
- 職種
- ハードウェアエンジニア
- 雇用形態
- 記載なし
- 給与
- 記載なし
- 勤務地
- 記載なし
- 働き方
- 記載なし
- 経験年数
- 5年以上
- 学歴
- 大学院修了以上
- 掲載日
- 2026/10/26 01:04（今日）
- 最終確認
- 2026/10/26 01:04（今日）
仕事内容
募集内容
- The Emerging Packaging Technologies at Texas Instruments is looking for a candidate for **HV GaN module** development engineer
Responsibilities:
- Design, develop, and characterize high voltage (200–1200V) packages and high-power modules targeting AI infrastructure and Industrial market
- Understand market trends and end equipment system requirements and translate these into package design specifications.
- Define packaging solutions across HV technologies including GaN, SiC, IGBT, and Isolation Technologies; validate designs using CAD, thermomechanical, and electrical parasitic extraction tools.
- Work with material suppliers (mold compounds, die attach, substrates) to qualify materials meeting HV application requirements.
- Collaborate with cross-functional teams across sites to support development and ramp of new products.
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応募は日本テキサス・インスツルメンツ合同会社の採用ページで受け付けています。このページは採用ページの掲載内容をもとに構成しているため、最新の応募条件は募集元でご確認ください。