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山形県の求人285件応募資格・募集要項・仕事内容を見る
Semiconductor Assembly Process Development Engineer
- 給与
- 記載なし
- 勤務地
- 山形県米沢市
- 休日
- 記載なし
- 雇用形態
- 正社員
- オフィス出社
どんな仕事かAIによる生成
This role is responsible for technology development in semiconductor back-end processes, including assembly, packaging, and testing. The work includes developing and evaluating advanced packaging technologies, developing materials and processes, supporting production line setup and mass production, and improving process quality and yield.
この求人に応募
応募資格
必須
- Minimum of 5 years of experience in technology development for semiconductor back-end processes (assembly and packaging)
- At least 5 years of experience in technology development in one or more of the following processes: Molding, Strip Grinding, or Package Sawing
- Hands-on experience in process improvement, quality control, and equipment introduction/implementation
- Bachelor’s degree or above in a technical field such as Mechanical Engineering, Materials Science, Electronics, Chemistry, or a related discipline
- Japanese: Business-level proficiency required, with the ability to participate in meetings, engage in technical discussions, and communicate effectively with internal and external stakeholders
- English: Approximately TOEIC 700 level, with the ability to communicate effectively in a business environment, particularly in reading and writing
歓迎
- Experience in developing packages for AI / HPC applications, particularly with a focus on high-reliability design
- Experience in the development of advanced packaging technologies such as FCBGA, FCCSP, or FCLGA
- Experience working with and meeting quality standards such as ISO or IATF
募集要項最終確認 10/23
- 職種
- 生産技術
- 雇用形態
- Full-time
- 給与
- 記載なし
- 勤務地
- 山形県米沢市
- 働き方
- 3. リモート No当社では、ハイブリッド勤務モデルを採用しており、従業員は週に2日間リモートワークを行うことができます。同時に、残りの日はチームとしてオフィスに集まり、協働を強化しています。出社指定日は火曜日から木曜日で、イノベーション、コラボレーション、そして継続的な学習に取り組む日としています。
- 経験年数
- 5年以上
- 学歴
- 大学卒業以上
- 掲載日
- 2026/10/20 23:06（3日前）
- 最終確認
- 2026/10/23 02:51（今日）
仕事内容
Job Description
- Our company actively drives technological innovation in semiconductor back-end processes, with a strong focus on next-generation packaging technologies such as Flip Chip and System-in-Package (SiP).
- In rapidly growing fields—including AI, high-performance computing (HPC), automotive, and IoT—there is increasing demand for packaging solutions with higher density, enhanced reliability, and superior thermal performance. In response, we are accelerating the development of advanced technologies such as FCCSP (Flip Chip Chip Scale Package) and FCBGA (Flip Chip Ball Grid Array).
- As device architectures become more complex and multifunctional, expanding our technological capabilities and strengthening our development organization are essential. To support this growth, we are seeking engineers with expertise in semiconductor back-end processes.
- This role offers the opportunity to work at the forefront of innovation—developing high-density, high-heat-dissipation packages for AI/HPC, as well as high-reliability solutions for automotive and IoT applications—and to contribute to technologies that underpin transformative advancements such as AI and autonomous driving.
- You will be responsible for technology development in semiconductor back-end processes, including assembly, packaging, and testing:
- Development and evaluation of advanced packaging technologies, including FCCSP and FCBGA
- Material and process development, as well as improvement of assembly processes (e.g., molding, strip grinding, ball mounting, marking, and package sawing)
- Support for production line setup and transition to mass production
- Driving process quality improvements and yield enhancement activities
この求人は、ルネサスエレクトロニクス株式会社の採用ページの内容をAIが読み取って整理したものです。応募の前に採用ページの原文を確かめてください。データの集め方企業サイト
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