職種・勤務地・キーワードで探す
Senior Program Managers
- 給与
- 記載なし
- 勤務地
- 東京都
- 休日
- 記載なし
- 雇用形態
- 記載なし
- 週3日 出社
どんな仕事かAIによる生成
The Senior Program Manager role is on the Advanced Packaging Technology Development Substrate and Wafer Assembly team, developing and delivering advanced substrate packaging and wafer assembly solutions. The role works with supplier engineering teams and internal teams to manage capacity, deliveries, lead times, certification plans, and new factory capacity qualification. It also includes regular travel to supplier sites and onsite presence at factories, with collaboration across Asia and the US.
この求人に応募
応募資格
必須
- Bachelor's or Master's degree with 8+ years, or PhD with 4+ years work experience, in Science or Engineering.
- 6+ years of experience in fab back-end or substrate manufacturing process development.
歓迎
- Experience in capacity management, lead time analysis, yield improvement, structured problem solving, situational leadership, supplier influence, and stakeholder management.
- Strong understanding of substrate process building blocks such as component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection/metrology, and electrical testing.
- Experience qualifying /owning process tools in a TD/ramp or HVM context is desired.
- Hands-on experience in factory operations, substrates, manufacturing, process engineering, and yield improvement is highly preferred.
- Fluent business-level English communication skills, excellent presentation abilities, and capability to engage effectively with supplier executive management.
求める人物像
- highly motivated professionals with strong technical expertise who thrive on solving complex challenges, challenge conventional approaches, and build lasting supplier partnerships.
募集要項最終確認 10/20
- 職種
- 生産管理
- 雇用形態
- 記載なし
- 採用区分
- Experienced Hire
- 役職
- Senior Program Managers
- 給与
- 記載なし
- 勤務地
- Japan, Tokyo
- 働き方
- Regular travel to supplier sites and onsite presence at factories (minimum three days per week).This role will require an on-site presence.
- 勤務時間
- Shift 1 (Japan)
- 経験年数
- 6年以上
- 学歴
- 大学卒業以上
- 掲載日
- 2026/10/12 05:14(9日前)
- 最終確認
- 2026/10/20 17:41(1日前)
仕事内容
Job Description:
- The Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD: S and WA) team develops and delivers advanced substrate packaging and wafer assembly solutions for customers. As part of the Substrate Technology Integration Group, within APTD, you will play a pivotal role in shaping the future of advanced packaging. In this role, you will:
- Work at the forefront of packaging technologies essential for next-generation AI devices.
- Collaborate with substrate suppliers worldwide to drive innovation and scalability.
- Contribute to the deployment of EMIB-T, our next-generation advanced packaging substrate technology, enabling heterogeneous chip architectures.
- Lead efforts to qualify new capacity at advanced packaging suppliers, ensuring timely readiness to meet growing customer demand. We are seeking highly motivated professionals with strong technical expertise who thrive on solving complex challenges, challenge conventional approaches, and build lasting supplier partnerships.
- Note: This position requires regular onsite presence to fulfil essential responsibilities.
Key Responsibilities:
- Collaborate closely with on-site supplier engineering teams and the US integration team to advance substrate building block technologies and manage critical process interactions.
- Monitor, optimize, and improve capacity in bottleneck processes by implementing strategies that reduce throughput time (TPT).
- Oversee schedules for product and test vehicle (TV) deliveries, proactively resolving issues to achieve aggressive on-time delivery (OTD) targets.
- Conduct thorough analysis of substrate lead times, develop reduction roadmaps, and consistently meet quarterly lead time goals.
- Ensure strict adherence to Process Control System (PCS) commitments by suppliers.
- Partner with internal teams to design and execute new factory TV/product certification plans focused on yield improvement.
- Develop and maintain detailed micro-schedules for new factory startups, including milestone tracking to ensure supplier compliance with startup timelines.
- Lead qualification activities and monitor ramp indicators to guarantee smooth, incident-free production ramp-up of new capacity.
- Influence strategic decision-making at senior supplier management levels.
Work Environment:
- Regular travel to supplier sites and onsite presence at factories (minimum three days per week).
- Collaboration with diverse teams across Asia and the US.
- Flexibility to adapt to evolving project scopes and dynamic business needs.
Work Model for this Role
- This role will require an on-site presence.
この求人は、インテル株式会社の採用ページの内容をAIが読み取って整理したものです。応募の前に採用ページの原文を確かめてください。データの集め方企業サイト
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