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ハードウェアエンジニアの求人230件
Senior Manager, Package Design Engineering
掲載中・今日に確認
- 給与
- 記載なし
- 勤務地
- 記載なし
- 休日
- 記載なし
- 雇用形態
- 正社員
- オフィス出社
どんな仕事か求人票をもとにAIがまとめたものです
Leads package technology development and NPI execution for Renesas AI and data center infrastructure power products. The role manages package and interconnect design and development, works with OSATs and contract manufacturers on qualification and production readiness, and leads assigned technology and product-development programs.
応募資格・募集要項・仕事内容を見るこの求人に応募
応募資格
必須
- Master’s or Bachelor’s Degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a related discipline; doctorate is a plus.
- 12 to 15 years of relevant semiconductor package development experience, including technical or project leadership responsibility, with emphasis on power SiP/modules, wafer-level packaging, and flip-chip packaging.
- Strong understanding of power SiP/modules, wafer-level and flip-chip packaging methods, assembly processes, package and product qualification, reliability methods, SPC, DOE, and statistical analysis tools. Knowledge of wire-bonding, multi-chip modules, SiC/GaN packaging, and advanced substrates is preferred.
- Demonstrated ability to lead cross-functional technical teams, manage multiple development programs, influence global manufacturing partners, and escalate risks with clear recovery plans.
- Strong interpersonal, written, and verbal communication skills.
- Strong analytical, problem-solving, project management, and presentation skills.
募集要項最終確認 10/5
- 職種
- ハードウェアエンジニア
- 雇用形態
- Full-time
- 役職
- Senior Manager
- 給与
- 記載なし
- 勤務地
- Tempe, Arizona, United States
- 働き方
- リモート No
- 経験年数
- 12年以上
- 学歴
- 大学卒業以上
- 掲載日
- 2026/10/03 10:27（2日前）
- 最終確認
- 2026/10/05 02:52（今日）
仕事内容
Responsibilities
- Lead package technology development and NPI execution, including R&D activities, coordination with global OSAT partners for new package development and product qualification, technology roadmap implementation, project budget tracking, and customer adoption programs.
- Manage the design and development of package and interconnect solutions for Renesas AI and data center infrastructure power products, including Smart Power Stages, Vertical Power Stages, Power Modules, and discrete FET packages.
- Support wide-bandgap SiC and GaN package development, DBC and AMB substrates, advanced interconnect technologies, wafer-level packaging, flip-chip, multi-chip modules, and power devices.
- Evaluate, select, and qualify materials, processes, assembly subcontractors (OSATs), and contract manufacturers in alignment with product requirements, quality standards, cost targets, and capacity needs.
- Partner with OSATs and contract manufacturers to plan and execute DOEs, optimize assembly processes, establish process specifications, and close technical gaps.
- Coordinate with Product Groups, Design, Applications, Quality, Operations, and Reliability teams to qualify new packages and processes within committed schedules.
- Drive resolution of package and process integration issues, ensuring robust process-window validation and risk assessment for critical manufacturing steps.
- Define and implement production controls, monitors, and corrective actions to prevent quality incidents and improve manufacturing robustness.
- Ensure smooth technology transfer into production and manage ramp-up monitoring, issue escalation, yield improvement, and readiness reviews.
- Work closely with OSATs and contract manufacturers to identify and resolve early-production process issues and ensure products meet quality, reliability, delivery, and customer requirements.
- Maintain strong technical expertise in power SiP/modules, wafer-level packaging, flip-chip interconnects, advanced substrates, and emerging power-package technologies, and translate industry developments into executable programs.
- Contribute to packaging roadmap development and lead execution of assigned technology and product-development programs, including schedules, resources, risks, and cross-functional deliverables.
- Lead technical response and corrective-action activities for internal and external customer concerns, partnering with Marketing, Product Groups, Quality, Operations, and Supply Chain teams.
- Establish, document, and maintain package design rules and engineering standards.
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