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Principal Engineer, Frontend Organizations Central Team, Dry Etch Process
- 給与
- 記載なし
- 勤務地
- 記載なし
- 休日
- 記載なし
- 雇用形態
- 記載なし
どんな仕事かAIによる生成
Lead productivity, yield, quality, and cost improvement engagements with global sites and the network team, including plasma process optimization and Dry Etch hardware and process improvement. Develop the Dry Etch CIP roadmap, improve process capability and recipe robustness, and collaborate with suppliers and global facilities on qualification, tool installation, and chamber monitoring.
この求人に応募
応募資格
必須
- Proven experience in plasma process and hardware improvement and development within the semiconductor industry, specifically in Dry Etch.
- Remarkable skill in developing and implementing hardware CIP roadmaps and start-up acceptance criteria for dry etch chambers and consumable parts.
- Strong analytical skills for evaluating, promoting, and planning new etch platforms, chemistries, and chamber kits (e.g., new electrode materials, edge rings, focus rings, showerheads).
- Tangible results in boosting tool performance, establishing process parameters, and streamlining process management projects.
- Ability to strictly adhere to safety, quality, and sustainability standards while driving innovative solutions.
- Bachelor's or Master's degree in Engineering (Chemical, Electrical, Materials), Physics, Materials Science, or a related field, or equivalent experience.
- Extensive experience in semiconductor equipment and process management in Dry Etch (LAM Kiyo / Flex / Vantex / Versys, TEL Tactras / RK, AMAT Sym3 / Centura, or equivalent platforms).
- Proven track record in maturing tool performance and establishing plasma process parameters for dry etch equipment.
- Experience in abnormal analysis (FDC, SPC excursions, chamber-matching deviations) and improvement, with a solid history of successful project implementation across DRAM and/or NAND flows.
募集要項最終確認 10/21
- 職種
- 生産技術
- 雇用形態
- 記載なし
- 役職
- Principal Engineer
- 給与
- 記載なし
- 勤務地
- 記載なし
- 働き方
- 記載なし
- 学歴
- 大学卒業以上
- 掲載日
- 2026/10/12 05:19（10日前）
- 最終確認
- 2026/10/21 22:16（1日前）
仕事内容
募集内容
- Strategize and lead productivity, yield, quality, and cost improvement engagements with global sites and the network team via plasma process optimization, new/FOAK chemistry & hardware qualification, and CIP development collaboration with dry etch suppliers. Collaborate with cross-functional teams to drive breakthroughs in defect reduction, particle/residue control, CD uniformity, profile control, and chamber-matching across the global fleet. Develop the process and hardware CIP roadmap for Dry Etch — covering chamber parts, RF/match networks, gas delivery, ESC, endpoint, and plasma source upgrades. Drive process & hardware improvement with emphasis on safety, defect reduction, cost efficiency, throughput, quality, and sustainability across Dry Etch modules (Conductor Etch, Dielectric Etch, Poly/Gate Etch, Metal Etch, High-Aspect-Ratio (HARC) Etch, Spacer/ALE, etc.). Partner with suppliers to establish equipment start-up acceptance criteria, chamber qualification flows, and tool service requirements; work with global facilities to address new tool installation requirements (abatement, exhaust, RF compliance, gas/chemical infrastructure). Set up IoT/FDC sensors and advanced chamber telemetry for defense-line strengthening in Dry Etch tools and develop new solutions for excursion prevention and chamber-health monitoring. Establish and improve process windows and recipe robustness, upgrade process capability (CD, profile, selectivity, ARDE, LER/LWR control), and reduce production costs (consumable lifetime extension, gas usage optimization).
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