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生産技術の求人993件応募資格・募集要項・仕事内容を見る
Front End Central Product Integration Engineer, Test & Product Yield Integration
- 給与
- 記載なし
- 勤務地
- 記載なし
- 休日
- 記載なし
- 雇用形態
- 記載なし
どんな仕事かAIによる生成
Lead global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products. Centralize information from global teams and drive project execution to closure. Work across functions and sites to resolve yield and quality challenges, advance packaging technology and chip-package interaction, and improve productivity and efficiency.
この求人に応募
応募資格
必須
- Bachelor's, Master's, or PhD degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science Engineering, or a related field.
- Product Integration
- Test Engineering
- Yield Engineering
- Design Engineering
- BEOL semiconductor processing or process integration
- Strong knowledge of Semiconductor Device Physics and DRAM product operations.
- Understanding of wafer fabrication process flows, parametric/electrical testing, and probe yield.
- Strong data analysis, debugging, troubleshooting, and problem‑solving skills with attention to detail.
- Effective verbal and written communication skills with the ability to present to both small and large technical audiences.
- Demonstrated ability to collaborate across functions and cultures, building strong customer and co‑worker relationships.
- Ability to work independently with minimal supervision, manage multiple priorities, and stay organized.
- Intermediate to advanced PC skills, including Microsoft Office.
- Willingness to travel approximately 20-50% to support global project needs.
- Flexibility to adapt to changing priorities and take on additional responsibilities as needed.
- Experience in DRAM High Bandwidth Memory (HBM) products.
- Exposure to DRAM HPM, advanced packaging, chip‑package interaction, BEOL integration, or layout‑related topics.
- Experience working across Test, Product, Yield, Design, Packaging, and Manufacturing organizations.
- Proven ability to drive alignment and execution in central or network‑level roles.
求める人物像
- Strong curiosity about innovation, continuous improvement, and scalable solution development.
募集要項最終確認 10/21
- 職種
- 生産技術
- 雇用形態
- 記載なし
- 役職
- Senior / Staff / Principal
- 給与
- 記載なし
- 勤務地
- 記載なし
- 働き方
- 記載なし
- 学歴
- 大学院修了以上
- 掲載日
- 2026/10/12 05:19（10日前）
- 最終確認
- 2026/10/21 22:16（1日前）
仕事内容
募集内容
- Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products. Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure. Drive yield breakthroughs by understanding the end‑to‑end test flow, product design and operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability requirements. Foster technical innovation by characterizing device failure modes using deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs. Define and drive strategies to ensure Packaging Technology and Chip‑Package Interaction are developed and qualified ahead of product qualification. Lead across functions and cross‑site taskforces (Product, Test, Yield, Design, Fab, Packaging, Quality, TD) to resolve yield and quality challenges in a timely manner. Promote network Best‑Known‑Method (BKM) development, standardization, and business process creation or re‑engineering to improve productivity and efficiency. Maintain strong working relationships with partners in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams. Communicate project status, risks, and proposals effectively through clear written reports and technical presentations. Proactively identify obstacles, escalate when needed, and partner with management to drive successful outcomes.
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