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Semiconductor Assembly Process Development Engineer
給与
記載なし※ 募集要項に金額の記載がありません
- 勤務地
- 記載なし
- 雇用形態
- 正社員
- 働き方
- オフィス出社
- 年間休日
- 記載なし
要約求人票をもとにAIがまとめたものです
You will be responsible for technology development in semiconductor back-end processes, including assembly, packaging, and testing. The role includes development and evaluation of advanced packaging technologies, material and process development, support for production line setup and transition to mass production, and process quality improvements and yield enhancement activities.
応募資格
必須
- Minimum of 5 years of experience in technology development for semiconductor back-end processes (assembly and packaging)
- At least 5 years of experience in technology development in one or more of the following processes: Molding, Strip Grinding, or Package Sawing
- Hands-on experience in process improvement, quality control, and equipment introduction/implementation
- Bachelor’s degree or above in a technical field such as Mechanical Engineering, Materials Science, Electronics, Chemistry, or a related discipline
- Japanese: Business-level proficiency required, with the ability to participate in meetings, engage in technical discussions, and communicate effectively with internal and external stakeholders
- English: Approximately TOEIC 700 level, with the ability to communicate effectively in a business environment, particularly in reading and writing
歓迎
- Experience in developing packages for AI / HPC applications, particularly with a focus on high-reliability design
- Experience in the development of advanced packaging technologies such as FCBGA, FCCSP, or FCLGA
- Experience working with and meeting quality standards such as ISO or IATF
使用ツール
募集要項最終確認 9/25
- 職種
- 生産技術エンジニア
- 雇用形態
- Full-time
- 給与
- 記載なし
- 勤務地
- Nakatsu, Japan
- 働き方
- 3. リモート No
- 経験年数
- 5年以上
- 学歴
- 大学卒業以上
- 掲載日
- 2026/09/25 20:58（4日前）
- 最終確認
- 2026/09/25 20:58（4日前）
仕事内容
Job Description
Our company actively drives technological innovation in semiconductor back-end processes, with a strong focus on next-generation packaging technologies such as Flip Chip and System-in-Package (SiP).
In rapidly growing fields—including AI, high-performance computing (HPC), automotive, and IoT—there is increasing demand for packaging solutions with higher density, enhanced reliability, and superior thermal performance. In response, we are accelerating the development of advanced technologies such as FCCSP (Flip Chip Chip Scale Package) and FCBGA (Flip Chip Ball Grid Array).
As device architectures become more complex and multifunctional, expanding our technological capabilities and strengthening our development organization are essential. To support this growth, we are seeking engineers with expertise in semiconductor back-end processes.
This role offers the opportunity to work at the forefront of innovation—developing high-density, high-heat-dissipation packages for AI/HPC, as well as high-reliability solutions for automotive and IoT applications—and to contribute to technologies that underpin transformative advancements such as AI and autonomous driving.
You will be responsible for technology development in semiconductor back-end processes, including assembly, packaging, and testing:
Development and evaluation of advanced packaging technologies, including FCCSP and FCBGA
Material and process development, as well as improvement of assembly processes (e.g., molding, strip grinding, ball mounting, marking, and package sawing)
Support for production line setup and transition to mass production
Driving process quality improvements and yield enhancement activities
この求人はルネサスエレクトロニクス株式会社の採用ページの掲載内容をもとに構成しています。応募条件の最新情報は募集元をご確認ください。
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応募はルネサスエレクトロニクス株式会社の採用ページで受け付けています。このページは採用ページの掲載内容をもとに構成しているため、最新の応募条件は募集元でご確認ください。